Precise Modeling Practice for Avionics PCB in Random Vibration Environment

Abstract

Electronic packaging analysis fraternity makes use of finite element method (FEM) to predict random vibration response experienced by printed circuit board (PCB) of any avionics electronic package. Degree of accuracy associated with such prediction enables the connoisseur to make apt verdict while ascertaining the design adequacy of the package. Achieving accuracy in prediction is dictated by the preciseness associated with the modeling practices adopted in FEM. Precision of a particular FE model in turn is influenced by proper consideration of material properties and boundary conditions. An attempt has been made to address these two major challenges in the present research work. Conventional means have been adopted to extract material properties. However a novel approach has been evolved to extract shear modulus of PCB. Rotational spring element has been used to simulate rotational degrees of freedom (DOF) of PCB. Rotational stiffness which needs to be keyed in as input for FE model has been extracted with the aid of experimentation. Further a database has been established consisting of rotational stiffness and damping values for various mounting configurations of PCB which are validated with experiments as well. By integrating these two key parameters with experimentally evaluated material properties, a precise modeling practice for PCB has been devised, methodically validated with that of experimentation and its consistency has been established. Any electronic packaging designer can make use of this precise modeling practice for evaluating the design adequacy of PCB in random vibration environment with finer degree of accuracy.

Cite this Article

Jagadisan K, Bangaru Babu P, Anil Kumar P. Precise Modeling Practice for Avionics PCB in Random Vibration Environment. Journal of Experimental & Applied Mechanics. 2016; 7(1): 51–59p.