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Development and Experimental Characterization of Metallic Spring Isolators for Electronic Packages of Air Borne Vehicles

P. Anil Kumar, P. Bangaru Babu

Abstract


During flight, electronic packages in air borne vehicles will experience aerodynamic induced loads like random vibration and shock. PCBs mounted in these packages either malfunction or fail due to high vibration which is due to the stacked mounting of PCBs. Desired gap between any two adjacent PCBs will be maintained with the help of rigid spacers in this mounting. It is understood that the solution for reducing this high vibration response is to relax the rigidity imposed by rigid spacers by some means without affecting the overall mounting stiffness. This requirement demands for one to one replacement of rigid spacer with vibration isolator. Commercial rubber isolators are not fit for electronic packages as shelf life of rubber is not on par with anticipated storage time of air borne vehicles. Keeping this constraint into consideration, it is being proposed in this research project to develop and experimentally evaluate metallic spring isolator. Challenging part of this task is achieving isolation both in random vibration and shock with intended metallic spring isolator against a common problem of general isolator. This paper brings out the details of this particular invention along with experimental characterization followed by isolation effectiveness.

Cite this Article

Anil Kumar P, Bangaru Babu P.

Development and Experimental

Characterization of Metallic Spring

Isolators for Electronic Packages of Air

Borne Vehicles. Journal of

Experimental & Applied Mechanics.

 

2016; 7(2): 9–18p

 



Keywords


Electronic packaging, finite element analysis-PCB, spring isolator, spring spacers, rigid spacer

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