Interference of Components in Metallic Diffusion

著者

  • Honey Garg Head, Materials and Metallurgical Engineering department, PEC University of Technology, Chandigarh, 160012 India
  • Priyavrat Thareja

キーワード:

Diffusion direction、 number of breakage of bond、 solid state alloy development

要旨

Eight different pairs of metals which diffuse in each other in a solid state composition and make a homogenous or heterogeneous mixture are considered for deeper understanding of diffusion phenomenon, w.r.t. direction of diffusion, etc. Further the authors interpret which factors are responsible for the metal and/or more specifically which metal atom will be active in the diffusion process. The analysis evidenced number of breakage of bonds in the substrate of the metals participating in the diffusion process and metal’s thermal conductivity additionally mattered. Study of greater influence, to make a clear judgment of active metal in the diffusion process, solicited decision as to which metal is active in the binary solid-solution diffusion process? The study reveals that there is a very close relationship between the active metal and the physical traits. The dependence of thermal conductivity, number of breakage of bond is analyzed using tabulation of the diffusion direction and the physical properties while defining the diffusion direction for typical pair of the metals. Keywords: Diffusion direction; number of breakage of bond; solid state alloy development

著者略歴

  • Honey Garg、 Head, Materials and Metallurgical Engineering department, PEC University of Technology, Chandigarh, 160012 India
    Heads Materials and Metallurgical Engineering department,PEC University of Technology. Member Editorial board, Indian Foundry Journal. Was meber Ed board, Powder Metallurgy, Quality International Journal from 1987 to 1993.Has innovated in Technical poetry, and authored elucidating Materials and Metallurgical Engineering processes and concepts.

ダウンロード

発行日

2014-03-14

巻号

巻 4 号 1 (2014)

セクション

Research Articles

ライセンス

Declaration and Copyright Transfer Form

(to be completed by authors)

 

I/ We, the undersigned author(s) of the submitted manuscript, hereby declare, that the above manuscript which is submitted for publication in the STM Journals(s), is not published already in part or whole (except in the form of abstract) in any journal or magazine for private or public circulation, and, is not under consideration of publication elsewhere.

·         I/We will not withdraw the manuscript after 1 week of submission as I have read the Author Guidelines and will adhere to the guidelines.

·         I/We Author(s ) have niether given nor will give this manuscript elsewhere for publishing after submitting in STM Journal(s).

·         I/ We have read the original version of the manuscript and am/ are responsible for the thought contents embodied in it. The work dealt in the manuscript is my/ our own, and my/ our individual contribution to this work is significant enough to qualify for authorship.

·          I/We also agree to the authorship of the article in the following order:

Author’s name                                    

 

1. ________________

2. ________________

3. ________________

4. _______________

 

We  Author(s) tick this box and would request you to consider it as our signature as we agree to the terms of this Copyright Notice, which will apply to this submission if and when it is published by this journal.