Growth and Description of Cu Nanostructure via a Chemical Reducing Process

Abstract

Chemical reduction process has been employed to produce copper (Cu) nanostructure by using L-ascorbic acid. The use of L-ascorbic acid makes this process cost effective. In this process, copper chloride (CuCl₂.2H₂O) has been used as a precursor to produce the Cu nanostructure. They were characterized through UV-visible (UV-Vis) spectroscopy, X-ray diffraction (XRD) and scanning electron microscopy (SEM). The experimental findings revealed that the molar concentrations of L-ascorbic acid played an important influence over the particles size. The result observed was the average particle size ~50 nm.

Keywords: Cu nanostructure, ascorbic acid, particle size, X-ray diffraction (XRD), scanning electron microscopy (SEM)

 Cite this Article

Barman SC, Saha DK, Mamur H, et al. Growth and description of Cu nanostructure via a chemical reducing process. Journal of Nanoscience, Nanoengineering and Applications. 2016; 6(3): 27–31p.