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Growth and Description of Cu Nanostructure via a Chemical Reducing Process

S.C. Barman, D.K. Saha, H. Mamur, M.R.A. Bhuiyan


Chemical reduction process has been employed to produce copper (Cu) nanostructure by using L-ascorbic acid. The use of L-ascorbic acid makes this process cost effective. In this process, copper chloride (CuCl2.2H2O) has been used as a precursor to produce the Cu nanostructure. They were characterized through UV-visible (UV-Vis) spectroscopy, X-ray diffraction (XRD) and scanning electron microscopy (SEM). The experimental findings revealed that the molar concentrations of L-ascorbic acid played an important influence over the particles size. The result observed was the average particle size ~50 nm.


Keywords: Cu nanostructure, ascorbic acid, particle size, X-ray diffraction (XRD), scanning electron microscopy (SEM)


 Cite this Article


Barman SC, Saha DK, Mamur H, et al. Growth and description of Cu nanostructure via a chemical reducing process. Journal of Nanoscience, Nanoengineering and Applications. 2016; 6(3): 27–31p.

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